Flexible Electronics News

Imec, Cascade Microtech Develop First Automatic Probe System for Advanced 3D Chips

Test system enables pre-bond probing of 3D chips with large-array fine-pitch micro-bumps.

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By: DAVID SAVASTANO

Editor, Ink World Magazine

Imec and Cascade Microtech, a FormFactor company and a leader in advanced wafer-probe solutions, announced the successful development of a fully-automatic system for pre-bond testing of advanced 3D chips.   Pre-bond testing is important to increase the yield of 3D stacked chips. The new system enables probing and hence testing of chips with large arrays of 40µm-pitch micro-bumps, on 300mm wafers. The relevance of this new tool is underlined by winning the 2017 National Instruments Engineering ...

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